Chip Wars Intensify: Intel, AMD, and SK Hynix Push Density Limits as UK Blocks AI Data Centers Over Environmental Fears
TL;DR
* SK Hynix introduces split-cell 5-bit PLC NAND flash to boost SSD density and reduce voltage stress
* Intel Integrates Glass Substrates into EMIB Packaging for Multi-Chiplet HPC GPUs, Enabling 78mm x 77mm Dense Architectures for Data Centers
* Intel hires ex-Qualcomm GPU chief Eric Demers to
